New brochure explains interconnect technologies

26 November 2007

ITT Interconnect Solutions (ITT ICS)visit website


ITT is offering a new Premier Technology brochure with technical Pull Sheet and White Papers for Pogo-Pin, Break-Away, Chip-on-Flex, Stacking, Quadrax and PHD fibre-optic interconnection products. An accompanying CD-Rom with animation files provides visualisations of these technologies.

The Cannon, VEAM and BIW products are presented in a neat Pocket Folder package for storage and to enable details to be re-visited. The White Paper technical information on the technologies includes connection details, exploded views and wiring information. Individual technologies are detailed on individual pull sheets that provide functionality and technology overviews, a technology summary, customer benefits and general application information. A full specification is supported by applicable international standard information and performance data.

Keith Teichmann, director of product management for interconnect solutions at ITT Corporation, comments: "The Pocket Folder Brochure provides a single reference point for the end user to determine which of these ITT interconnection technologies is best suited to their particular environment."

The Premier Technology Brochure can be ordered via

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