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New brochure explains interconnect technologies

26 November 2007

ITT Interconnect Solutions (ITT ICS)visit website

 

ITT is offering a new Premier Technology brochure with technical Pull Sheet and White Papers for Pogo-Pin, Break-Away, Chip-on-Flex, Stacking, Quadrax and PHD fibre-optic interconnection products. An accompanying CD-Rom with animation files provides visualisations of these technologies.

The Cannon, VEAM and BIW products are presented in a neat Pocket Folder package for storage and to enable details to be re-visited. The White Paper technical information on the technologies includes connection details, exploded views and wiring information. Individual technologies are detailed on individual pull sheets that provide functionality and technology overviews, a technology summary, customer benefits and general application information. A full specification is supported by applicable international standard information and performance data.

Keith Teichmann, director of product management for interconnect solutions at ITT Corporation, comments: "The Pocket Folder Brochure provides a single reference point for the end user to determine which of these ITT interconnection technologies is best suited to their particular environment."

The Premier Technology Brochure can be ordered via www.ittcannon.com.

 
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