Omron’s inspection paper for FMD compliance at Interpack 2014

07 May 2014

Omron Electronics Limitedvisit website


During a new 3-day Components event at Interpack 2014, Omron will present a paper on its optical inspection systems at the Components Forum. Date & location: May 9, 12:20pm, Congress Centre South. Presented by: Gunnar Bischoff, Business Model & Industry Marketing Manager.

Attendees will hear how the FH-series vision system is a proven system for compliance with the Falsified Medicines Directive (FMD) and its impending requirement for serialised 2D code verification.

Pharmaceutical manufacturers, who are now faced with reading more pack data at high speed, only have until 2017 to comply with the directive. Gunnar Bischoff comments: “Regulation and supply chain pressures are making high-speed serial code verification, pack inspection and traceability a fact of life. I will discuss how the FH-series systems deliver faster processing speeds and a net reduction in errors, thanks to their higher-speed pattern-matching – our system ensures manufacturers remain FMD compliant.”

With a track record in state-of-the-art vision systems, Omron is one of the few specialists that have been invited to deliver a presentation as part of the new Interpack Components for Processing and Packaging exhibition and seminar programme. Mr Bischoff will present to show attendees and exhibitors a summary of advances in inspection technology, as well as demonstrating how a 10-fold increase in speed can benefit both inspection quality and code verification, plus new features that will revolutionise the inspection industry including how new algorithms address the effects of machine vibration and changing light conditions.

Ten times faster than conventional systems, the FH-series vision system features technology including fast pattern-matching capabilities that increase image processing speeds and reduce errors that represents an industry breakthrough.

As a supporting event for “components for processing and packaging” 2014, the Components Forum is being organised by IEE, the exclusive media partner of Messe Düsseldorf. From May 8–10, visitors can expect an interesting mix of technical lectures and panel discussions. Experts from the packaging industry will be discussing exciting topics with users and suppliers over three days. Talks and presentations will be delivered by the exhibiting companies making the Forum a platform for knowledge transfer and exchange of opinion. Seminar sessions are free to attend.

Find the company at Hall CS (CCD Stadthalle), Stand 318 - Components for Processing & Packaging (part of Interpack). In addition, Omron will present integrated automation systems that provide the packaging industry with flexible, efficient and cost-effective ways that enable quick and simple integration of advanced motion, safety, vision and robotics systems into packaging lines. For more information please go to

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