Think IO-Link for efficient manufacturing processes

05 August 2015

Balluff Limitedvisit website


With such a high demand to increase productivity and flexibility of machines and processes while maintaining healthy margins, inefficient technology throughout the production line can cause major issues with downtime. Balluff will be showcasing how I-O Link can change all that on stand F50 at PPMA 2015.

IO-Link is quickly becoming a critical element of the manufacturing environment and forming a strong backbone for industrial networks. As a founding member of the IO-Link consortium and the market leader in Distributed Modular I/O utilising IO-Link, Balluff offers the most devices available in the market encompassing I/O and connectivity systems.

Find out more about how I-O Link can be easily integrated in existing systems to help reduce maintenance costs, achieve optimum efficiency and productivity while reducing downtime, gone are the days of a single faulty device causing mass facility shutdowns.

As it is network neutral IO-Link also offers flexibility and can be easily configured across multiple vendors, thus reducing the cost of design and implementation. A simplified installation process through a uniform standard interface is as easy as attaching a standard connector.

Balluff will also be showcasing a variety of technologies including object detection, vision, industrial identification and fluid sensors for the primary, secondary or end-of-line packaging industry. The company’s aim is to add value to automated systems by providing a wide range of enabling technologies that unlock hidden productivity potential.

Visit Stand F50 at the PPMA exhibition to find out more about I-O Link and the Balluff range of products, or go to

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