Expanded-beam interconnects meet Telcordia GR-1435 specification

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Molex Incorporated is launching the VersaBeam family, which is focused on expanded-beam interconnects. The first product introduced under the VersaBeam name is the VersaBeam POD Cable Assemblies that provide a low-profile, expanded-beam, 12-fibre interconnect designed specifically to mate with Avago Technologies’ MicroPOD* and MiniPOD* parallel optic modules. The assemblies are the first on the market to meet Telcordia GR-1435 environmental specifications required by telecommunications equipment providers, and are available in both a 1.80mm jacketed round version, in addition to the bare ribbon-fibre versions.

VersaBeam POD Cable Assemblies feature a perpendicular mating capability to provide optimum airflow and ribbon cable management, as well as increase real-estate opportunities on dense printed circuit boards (PCBs). Tom Schiltz, group product manager, Molex, says: “We worked closely with Avago to develop a solution that not only meets telecom specification standards for optical-cable to optical-module mating, but also provides optimum airflow and cable management for next-generation applications in emerging high-speed data and computer markets.”

The VersaBeam POD Cable Assemblies are interconnected through the Molex line of front-panel and blind-mating optical backplane connectors, providing customers with a wide selection of high-density interconnects for a variety of system architecture designs. By using 24-, 48- and 72-fibre MT ferrules, VersaBeam POD Cable Assemblies can be mated to the Molex high-density interconnects including HBMT, Array Connector and Circular MT connectors. With multiple Molex manufacturing sites qualified, Molex VersaBeam POD assemblies are available to meet high-volume requirements needed for next-generation applications.

Follow the link for more information about VersaBeam POD Cable Assemblies. To receive information on other Molex products, you can sign up for an e-nouncement newsletter at

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