Embedded technology boosts displacement sensor performance
Posted to News on 19th Aug 2010, 12:51

Embedded technology boosts displacement sensor performance

Micro-Epsilon has developed a new Embedded Coil Technology (ECT) for eddy current displacement sensors and Embedded Capa Technology (ECT) for capacitive displacement sensors, together with new manufacturing methods. These enable a wide variety of custom sensors to be produced, which are not only capable of operating in higher temperatures, but also benefit from low thermal expansion (thermal drift) and extremely compact conditioning electronics. One sector in particular where the sensors will be useful is aerospace.

Embedded technology boosts displacement sensor performance

Micro-Epsilon's new Embedded Coil Technology (ECT) is claimed to represent a technological breakthrough in eddy current sensor design and manufacture, enabling the previous limitations of using eddy current sensors to be overcome. Due to an ultra-compact design and the use of new inorganic materials in their construction, the new eddyNCDT ECT eddy current sensors are said to provide almost unlimited scope in terms of the external design and geometrical shape of the sensor. This means the sensors can be adapted to suit virtually any application requirements.

EddyNCDT ECT sensors are extremely robust, resulting in longer service intervals and higher temperature stability. In addition, the complete circuit electronics can now be integrated within the sensor, thereby saving even more space for OEMs and machine builders. The sensors are also suitable for harsh operating environments, including high vibration, impact shocks and high operating temperatures as high as 350degC. Sensors have been produced with extremely low thermal drift and with temperature errors of less than 20ppm/K (parts per million per Kelvin).

Custom designs

Chris Jones, the Managing Director of Micro-Epsilon (UK), comments: "Embedded coil technology has enabled us to produce custom-specific designs for OEMs. ECT eddy current sensors are already being used in a variety of applications, including: the alignment of mirror segments on giant reflector telescopes; for use in ultra-high vacuums or clean rooms in semiconductor manufacturing; and for measuring the grinding gap on refiners used in paper mills. We are also developing specific solutions for the aerospace and defence sector.

"Using our electronics expertise from within the Micro-Epsilon Group, we were able to develop extremely compact electrical circuits, which allowed us to manufacture the sensor with integrated electronics in the sensor head. We are therefore able to produce a single or multiple sensor channel arrangement in one sensor body."

Capacitive sensors

As well as eddy current sensors, Micro-Epsilon has also designed capacitive displacement sensors that make use of Embedded Capa Technology (ECT). The capaNCDT ECT capacitive displacement sensors are manufactured using a new type of production process. Similar to the eddy current ECT method, by embedding the electronic components in an extremely stable carrier material, significantly better temperature stability can be achieved compared to conventional capacitive displacement sensors.

CapaNCDT ECT sensors can withstand operating temperatures as high as 200degC, as well as very low temperatures down to -269degC. Similar to eddyNCDT ECT sensors, the capacitive versions are extremely compact. Micro-Epsilon's capaNCDT CSH-FL, for example, has an installation height of just 4mm.

Follow the links for more information about Micro-Epsilon's eddyNCDT ECT and capaNCDT ECT displacement sensors.


Micro Epsilon UK Limited

No. 1 Shorelines Building
Shore Road
CH41 1AU
UNITED KINGDOM

+44 (0)151 355 6070

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