Posted to News on 26th Jan 2009, 16:31
Epoxy is thermal conductor and electrical insulator
Master Bond EP37-3FLFAN is a thermally conductive and electrically insulating potting compound. It is an attractive choice for applications where a dielectric heat transfer adhesive is required. This two-part epoxy has good physical strength properties and a high degree of flexibility that holds up well to temperatures up to 120degC and in cryogenic environments down to 4K.
The adhesive exhibits an impressive thermal conductivity of 25BTU and a volume resistivity of 1 x 1014ohm cm, which is said to be good for an electronic potting epoxy. This compound is formulated to cure at room temperatures and forms tough bonds that are resistant to shock, impact, thermal cycling and chemicals.
EP37-3FLFAN is suitable as a potting material and encapsulation system due its low viscosity and flow characteristics. The thermally conductive adhesive retains a high level of flexibility while possessing the desirable physical characteristics inherent in epoxies.
