A new Perfect Wireless Interconnect for handheld devices, which boasts improved signal transmission and reception, and no field failures, is being launched by ITT Interconnect Solutions. An additional challenge on such wireless applications is to provide a high-specification interconnect to fit into extremely limited board space; in the case of an antenna interconnect, the available space measured only 0.3mm by 1.0mm and the working height was 0.90mm.
To meet these constraints, ITT ICS designers have created the new Perfect Wireless Interconnect, a 300k psi domed interconnect contact with a minimum of 0.5N of force and 0.60mm of deflection that holds true signal integrity through the antenna. The Perfect Wireless Interconnect has a reduced length to fit tight spacing, yet it withstands manufacturing stresses and remains stable on the board. Available in beryllium copper (BeCu) or titanium copper (TiCu), it also features side walls to provide beam protection and a solder well to prevent wicking.
ITT says the new Perfect Wireless Interconnect can be used as a SIM, speaker/vibrator, microphone, battery or board-to-board contact for a variety of wireless handheld applications, including handsets, smart phones, laptop computers, memory sticks, CT scanning equipment, key fobs and GPS units.
More details are available in an Application Note freely downloadable from www.ittcannon.com.