Three years after the launch of the ETXexpress specification in 2004, which has now become the PICMG COM Express (COM.0) standard, Kontron is defining a new footprint variant of the Computer-On-Modules (COMs) standard: nanoETXexpress.
The nanoETXexpress specification is targeted to deliver extremely power-saving COMs with mid- to high-performance x86 technology on a footprint that is a mere 55 x 84 mm. This is 39 per cent of the original COM Express module Basic form factor 125 x 95 mm footprint and 51 per cent of microETXexpress (95 x 95mm). This new COM form factor follows the PICMG COM Express standard and will be 100 per cent compliant with the COM.0 Type 1 connector. The locations of the identically mapped pin-outs will also be 100 per cent COM.0 compliant.
Kontron's goal with the nanoETXexpress specification is to build PCIe-based COMs on the smallest possible form factor. Many new applications that will benefit from the nano-size include handheld units for medical, mobile data and other emerging applications that have not been possible as of yet due to size restrictions.
Dirk Finstel, CTO for Kontron's embedded modules division, comments: "The nanoETXexpress specification will provide the ideal footprint for future applications, bearing in mind that forthcoming processor and system-on-chip (SoC) technology will be delivered in 45nm technology and beyond."
The specification and documentation for nanoETXexpress will be available under a non-disclosure agreement in Q4 2007. Kontron plans to launch its first nanoETXexpress-based COM in Q2 2008.