Posted to News on 1st Apr 2010, 09:41
Modular power connectors handle higher current density
Tyco Electronics has developed a new breed of power interconnects to meet the growing demand for increased current density with modular power connectors. The Multi-Beam XLE and Minipak HDL connectors are said to make better use of available airflow and offer improved long-term reliability. Contact design and materials have been upgraded to address challenges related to energised mate and unmate cycles and exposure to corrosion-enhancing environments while maintaining low millivolt drops.
Mike Blanchfield, Tyco Electronics' Product Manager and presenter of the power webinar, comments: "While currently available standard solutions fall short of the high-performance future needs of the industrial, computer and telecommunication markets, Tyco Electronics believes these new power interconnects will provide such solutions that will endure for years to come."
On 30 and 31 March 2010, Tyco Electronics will present a webinar entitled Power Interconnect Solutions: Increasing Current Density and Reliability. It will discuss high-performance power distribution interconnects and other topics related to heat dissipation and long-term reliability.
Get an overview of the latest TE Connectivity Power Interconnect Products.
