National Instruments is announcing further integration of the NI Multisim and LabVIEW platforms. By integrating the recently released Multisim 10.1 and LabVIEW, engineers can better identify and analyse design behaviour and detect errors at the earliest stages of design. Additionally, with the beta version of the NI LabVIEW Multisim Connectivity Toolkit, engineers can now enhance circuit design.
Multisim makes it possible to build circuit schematics and simulate circuit behaviour interactively in a highly graphical environment. Because Multisim abstracts the complexity of SPICE simulation, engineers do not need in-depth SPICE expertise to capture, simulate and analyse new designs fast. With enhanced simulation, engineers reduce the number of design errors and achieve a quicker prototype turnaround with fewer iterations.
Vincent Accardi, General Manager of National Instruments’ Electronics Workbench Group, says: "The continued integration between Multisim and LabVIEW is providing an increased level of productivity for the professional design engineer. By bridging the gap between design and test, we are addressing the gap between software and hardware and, in turn, reducing design errors and iterations to the final product to provide engineers with the tools to innovate and be successful."
Multisim 10.1 introduces professional design features including a focus on enhanced simulation capabilities, increased compatibility with PSpice models and a database of 300 new components from a range of vendors, such as Analog Devices and Texas Instruments. Multisim 10.1 also features the Multisim Automation API to help engineers automate simulation with COM-aware programming languages.
The beta version of the LabVIEW Multisim Connectivity Toolkit, which builds on Multisim 10.1, further integrates the capabilities of Multisim circuit design with the LabVIEW measurement platform. With the new toolkit, engineers can increase productivity in circuit designs by automating circuit simulation and correlating simulation behaviour to physical prototype measurements. These productivity increases help overcome time-consuming and costly validation inaccuracies. The new LabVIEW Multisim Connectivity Toolkit combines these automation capabilities and makes it possible for LabVIEW to provide rapid connectivity to both simulation and real-world measurements of circuits. Within a single test environment, engineers can acquire both real and simulated circuit measurements to correlate and analyse circuits to reduce cost and development time with an improved, methodical approach to benchmarking prototype behaviour.
With more than 80 new functions in the connectivity toolkit, engineers have the ability to run, pause and stop simulations as well as view circuit schematics in LabVIEW and change the component values. The integration between Multisim and LabVIEW in this toolkit can also reduce development time by automating the file transfer between Multisim and LabVIEW required previously when integrating the two software platforms.
Multisim 10.1 can be purchased as a complete, integrated design and test platform that includes the board layout and routing of the NI Ultiboard 10.1 environment. Multisim 10.1 is currently shipped in English, German and Japanese versions. Download a beta version of the connectivity toolkit for free at www.ni.com/labs. Alternatively, use the form on this page to request a callback or more information.