Sick launches next-generation ultrasonic fork sensors

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Sick launches next-generation ultrasonic fork sensorsTransparent labels and substrates pose no problems for the new SICK UF Next fork sensor which uses ultrasonics to sense label position precisely whether clear, opaque, with coloured or printed designs, different web materials or even foils and metallics.

The versatility of the improved design is matched by a fast response time to ensure accuracy even at high web speeds, making it suitable for a wide range of packaging and labelling applications.

Phil Dyas, Sensor Expert SICK (UK), explains: “The UF Next solves a host of problems encountered in labelling. It will even detect double sheets, overlaps and two ply materials. The ultrasonic technology overcomes the false signals picked up by optical sensors and this model is unaffected by temperature changes, so you really only need one sensor to cover all label types.”

SICK’s UF Next fork sensor has a compact and rugged IP 65 aluminium housing, allowing it to be located in tight spaces and withstand difficult industrial conditions.

With a minimum detection space between labels of 2mm and a stable response time of 250usec, the SICK UF Next is suitable for long-run, high-speed labelling operations. Quick set-up is achieved via the dynamic teach-in, using either a control panel or remote wire, with manual fine tuning by the +/- buttons on the housing.

For more information on the UF Next fork sensor, please email , or visit the website at

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