Posted to News on 31st Dec 2010, 13:59
VLP DDR3 DIMM sockets require less space
Tyco Electronics (TE) is introducing a new very low-profile (VLP) double-data-rate 3 (DDR3) dual in-line memory module (DIMM) socket that is designed around JEDEC industry standards. With a maximum latch height of 16mm, the reduction in the overall height of the socket mated with a DIMM module enables enclosures to be smaller or boards to be mounted closer to each other, while facilitating the heat elimination of high-end servers.
TE's VLP DDR3 DIMM socket addresses interconnect requirements across server, communications, and notebook platforms. The product can be applied to high-end servers and communications equipment in a variety of industries including consumer/mobile devices, industrial and automotive.
The product is available with three gold plating options, two latch options (black or white) and is surface mountable.
Find out more about Slim solutions from TE Connectivity.
