Posted to News on 10th Jan 2013, 11:08
Adlink Technology for Embedded World 2013 Nuremberg
Adlink Technology Inc. will present a number of new highlights at the Embedded World Show Nuremberg at booth 1/1-532, including their latest COM Express offering, the Express-IB. The Express-IB is a high-performance COM.0 R2.0 Type 6 module featuring an Intel Core i7/i5/i3 processor supporting Intel HD Graphics integrated on the CPU with three independent displays. A PCI Express ×16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2×8 or 1×8 + 2×4).
Express-IB targets applications in Government, Military, Medical, Digital Signage and Communications and is suitable for customers with advanced processing performance and graphics requirements looking to reduce development time by outsourcing the base design of their system and focusing on application functionality.
New with the COM Express Type 6 module are three Digital Display Interface (DDI) ports supporting HDMI, DVI and DisplayPort outputs, in addition to legacy VGA and dual-channel 18/24-bit LVDS displays. The Express-IB also offers Gigabit Ethernet, up to four USB 3.0 ports, four USB 2.0 ports, two SATA 6 Gb/s ports and two SATA 3 Gb/s ports (RAID 0/1/5/10) and support for SMBus and I2C. The module is equipped with AMI EFI BIOS supporting remote console, CMOS backup, hardware monitor and watchdog timer.
Another highlight is the Ampro by Adlink Extreme Rugged CoreModule 720. PC/104-Plus Single Board Computer (SBC) with Intel Atom Processor E600T Series and Industrial ReadyBoard 910 EPIC SBC with 2nd generation Intel Core i7/i5/i3 and Intel Celeron processors. Both SBCs feature onboard Solid State Drives (SSD) and provide a compact form factor suitable for applications in harsh environments such as transportation, self-service, digital signage, and video surveillance.
The CoreModule 720 is based on the Intel Atom Processor E600T series from 600 MHz up to 1.6GHz in PC/104-Plus stackable form factor, allowing customers to build low-power systems for space-constrained, extremely rugged environments. The CoreModule 720 provides PCI and ISA bus connectivity, an integrated industrial grade 8GB SSD, CAN bus, SATA, and a broad range of peripheral I/O support. Additional features of the CoreModule 720 include support for up to 2GB DDR2 industrial-grade soldered SDRAM at 667/800MHz and 24-bit LVDS and SDVO graphics. The Intel Platform Controller Hub EG20T accommodates a wide range of common I/Os, such as USB, SATA, GbE, SDIO, Serial, and CAN bus. Designed to meet stringent shock and vibration requirements, the CoreModule 720 uses a 50 per cent thicker printed circuit board (PCB) and supports an extended temperature range of -40degC to +85degC.
Adlink's ReadyBoard 910 integrates the 2nd generation Intel Core i7/i5/i3 and Intel Celeron processors (Socket G2) and mobile Intel HM65 Express chipset, onboard SSD, and robust I/O in a compact EPIC form factor. The ReadyBoard 910 supports three display interfaces, including analog VGA, LVDS, and DVI-D, and features dual Gigabit Ethernet, SuperSpeed USB 3.0 with 5 Gb/s data transfer rate, PCI Express Mini Card socket, and PCI-104 expansion.
Low-power fanless computers
Also highlighted will be the Intel Atom D2550 Processor-Based Fanless Embedded Computer MXE-1300. The new Matrix MXE-1300 series of low-power fanless computers based on the Intel Atom D2550 processor is equipped with the Intel Atom D2550 processor, the MXE-1300 increases processing power by 44 per cent and graphics performance by 90 per cent over the previous Intel Atom platform. Featuring low power consumption, rich I/O capability, and large storage with 3.5" HDD support, the MXE-1300 series has a fanless, cable-free and robust mechanical design in a compact form factor, and is an application-oriented platform for digital surveillance, intelligent transportation, and factory automation applications.
On show will be Adlink's 3.5" HDD support in a compact form, the ADLINK MXE-1300 series, which adapts a 3.5" standard height hard disk drive to a 210mm (W) × 170mm (D) × 58mm (H) containment, providing the industry's most compact fanless system supporting 3.5" storage capability, significantly reducing storage costs and physical space requirements for high-resolution image processing and transmission applications.
Featuring operating shock tolerance up to 100G, an extended operating temperature range of -20degC to 70dehC, and thermal design with zero cable management requirements, the MXE-1300 provides reliable performance in mission-critical and harsh environments. The MXE-1300 also supports multiple OS, including Windows 7, Windows 7 Embedded, Windows XP, Windows XP Embedded, WinCE 7.0, and Linux.
For more information, go to www.adlinktech.com, or visit the company at Embedded World 2013, Nuremberg, Booth number : 1/1-532, February 26-28 2013.
