Posted to News on 17th Dec 2012, 17:35
COM Express ICES 667 is powered by 3rd Gen Intel Core processor
Nexcom COM Express Type 6 Basic module ICES 667 features the 3rd generation Intel Core processor family paired with mobile Intel QM77 Express Chipset. It supports socket-type processors ranging from dual-core Celeron Processor B810 to quad-core i7-3610QE processor and up to 16GB DDR3 1333/1600MHz SDRAM.
With the integrated Intel HD Graphics 4000 and DirectX 11 support, the COM Express ICES 667 can simultaneously drive three independent displays. It also integrates USB 3.0, SATA 3.0 and PCIe 3.0 interfaces, all living up to the latest industrial standards to allow for high-speed communication with peripherals and storage units.
To enhance remote manageability, ICES 667 supports Intel Active Management Technology 8.0 (AMT 8.0) and provides RAID 0/1/5/10 function to improve data access and protection.
To facilitate rapid deployment of individual projects, NEXCOM offers the ICEK 667-T6 Starter Kit to help clients immediately assess ICES 667 and the full set of I/O functions it supports. With the Starter Kit, users can quickly come up with design modifications, effectively shortening product development process to enable smooth project implementation.
PICMG COM.0 Rev. 2.0 Type 6, Basic module (95mm × 125mm):
- rPGA 988 socket for the 3rd generation Intel Core processors
- Mobile Intel QM77 Express Chipset (Optional HM76)
- Dual DDR3 1333/1600MHz SO-DIMM sockets for up to 16GB
- 3× independent displays: DisplayPort, HDMI, DVI, VGA, dual channel 18/24-bit LVDS
- 1× PCIex16, 7× PCIex1, 4× USB 3.0, 8× USB 2.0, 2× SATA 3.0, 2× SATA 2.0 and GbE
For further details about the COM Express Type 6 Basic module ICES 667 from Nexcom, please go to www.nexcom.co.uk/.
