Posted to News on 10th Dec 2018, 11:47
High-current interconnect system designed for easier mating
Molex offers the innovative Coeur CST High-Current Interconnect System featuring a new float design that accommodates pin to socket misalignment allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without the risk of overstress damage to the socket contact system.
Jeff Gaumer, global product manager, Molex says: "It is difficult to have perfect pin-to-socket alignment when mating two rigid PCBs or bus bars. In the Coeur CST High-Current Interconnect System, our design allows for the entire core socket assembly to move within an outer housing, preventing potential overstress damage to the contacts. This makes Coeur CST ideal for applications where the need for float is critical for Power Distribution mechanical packaging."
In addition to this float design providing 1.00mm of axial float, the Coeur CST High-Current Interconnect System is also compact in size allowing for a mated board-to-board profile as low as 5.00mm that does not require a large protrusion above or below the mated boards. The system also offers sockets with or without the float feature.
The flexible, scalable Coeur CST High-Current Interconnect System delivers between 30.0 and 200.0A of current and offers a wide range of configurations to accommodate PCB, bus bar, and wire systems. Multiple contact beams optimise electrical performance. The same common contact design is used on all CST form factor sockets (3.40, 6.00, and 8.00mm).
The wire-to-board and wire-to-wire Coeur CST products will include male and female crimp contacts, single and multi-row housings with features such as touch safe, mate-first-last-break option, positive latching, panel-mount options, vertical and right-angle configurations, and PCB and bus bar mounting header options.
For more information about the Coeur CST High-Current Interconnect System, please visit www.molex.com/link/coeur.html.
