Intelliconnect will be exhibiting at the 2018 IEEE/MTT-S International Microwave Symposium (IMS 2018) being held in Philadelphia in June. The IMS2018 Exhibition will feature over 500 exhibitors representing the state-of-the-art in components, materials, devices and subsystems, as well as design and simulation software and test and measurement equipment. Industry leaders including Intelliconnect will be available to answer technical and purchasing questions.
Of special note to visitors will be Intelliconnect's newly developed solderless 2.9mm connectors. Featuring clamping technology providing solderless attachment to 0.085"(RG405) and 0.141" cables, the connector provides similar I/L and VSWR results to standard soldered connectors. No special tooling is required and cable retention force is similar to soldered versions. These stainless steel 2.9mm connectors have been designed for applications where reliability, durability, robustness and high-frequency performance are very important. System designers will find the main advantages of these connectors are faster assembly time, repeatability and performance and they also provide field replaceable connectivity.
Also on display will be the Pisces range of IP67 and IP68 waterproof RF connectors, including the corrosion-proof version manufactured from a nickel aluminium bronze alloy.
In addition to their wide standard connector range and custom design and manufacturing capabilities, Intelliconnect will be showing their cable assembly capabilities which now include cryogenic versions for research, test and measurement and advanced IT systems.
Roy Philips, managing Director of Intelliconnect (Europe), comments: "We are pleased to be exhibiting at IMS2018 and looking forward to showing visitors our wide range of standard connectors, custom design capabilities, cable assembly capabilities and the opportunity to meet our UK and USA design and sales teams."
For more information visit www.intelliconnect.co.uk.