New UV/light and rapid moisture cure encapsulants
Posted to News on 22nd Aug 2013, 17:32

New UV/light and rapid moisture cure encapsulants

The new DYMAX 9100 series of light/moisture-cure encapsulants from Intertronics is a selective range of products for protection of small areas of PCBs where sensitive chips or other devices can be encapsulated by a glob top process. In particular, the DYMAX 9101, 9102 and 9103 now provide a rapid secondary moisture cure for shadowed areas. The additional curing process gives a more secure cure where the adhesive may flow under the encapsulated device. This could be a chip-on-board application where there is a need to lend mechanical support to fragile wire connections - also of course chip-on-flex, chip-on-glass and traditional wire bonding. Localised protection may thus be selectively provided to a particular area for vibration damping, structural integrity, mechanical protection or environmental protection reasons.

New UV/light and rapid moisture cure encapsulants

Dymax Dual-Cure 9101, 9102, and 9103 are resilient, chip-encapsulant materials designed with a UV/visible light cure and a very quick secondary ambient moisture-cure system, making them suitable for encapsulation applications where shadowed areas are present. These materials cure tack free after UV cure, so boards can be handled sooner with less potential for damage. The 9100 series rapid 2-day moisture cure - compared with 7 days typical with other systems - shortens the time for further handling as well as final testing and assembly.

These three new materials have varying viscosities of 7,000, 17,000, and 25,000 cP, to match the material creep and slump required of particular applications. This choice allows for performance and dispensing to be optimized with jet dispensable capability for more accurate placement and more efficient material usage. The cured materials are flexible, reducing stress to on board components. Unlike other encapsulants, the 9100 series do not require refrigeration for transportation/storage of the uncured material, so no additional associated costs are incurred.

For further information about the DYMAX 9100 series of light/moisture-cure encapsulants please see www.intertronics.co.uk/encapsulants, or visit their blog at www.adhere.uk.com.


Intertronics

Station Field Industrial Estate
Banbury Road
OX5 1JD
UNITED KINGDOM

+44 (0)1865 842842

Bosch Rexroth Pilz Automation Ltd Procter Machine Safety ABSSAC Ltd SICK (UK) LTD Mechan Controls Ltd WEG (UK) Ltd Servo Components & Systems Ltd Machinesafe Compliance Ltd Micro Epsilon UK Limited Rittal Ltd Smartscan Ltd AutomateUK Phoenix Contact Ltd PI (Physik Instrumente) Ltd Dold Industries Ltd Murrelektronik Ltd STOBER Drives Ltd AutomateUK M Buttkereit Ltd Leuze electronic Ltd FATH Components Ltd Kawasaki Robotics (UK) Ltd Euchner (UK) Spelsberg Els UK Ltd Aerotech Ltd HARTING Ltd Heidenhain (GB) Ltd