SiP Test & Production Alignment Engine from PI

The convergence of silicon-based electronics and photonics promises a leap in data throughput, parallelism, and energy efficiency. Design and materials challenges have by now been addressed. Practicalities of testing and packaging have not.

Test and packaging of silicon photonics elements require nanoscale alignments that cannot be performed using visual or mechanical references. Instead, these optimisations must enhance the optical throughput itself. In addition, SiP designs often incorporate multiple parallel optical paths with multiple, interacting inputs and outputs, all needing optimisation. Simple economics, as well as optical realities, dictate that these be optimized simultaneously, yet until now there has been no technology capable of doing this.

With more than three decades of experience in ultra-precision motion control for semiconductor manufacturing and metrology, PI has addressed the need for fast, parallel, nanoscale-accurate, multi-degree-of-freedom global optical alignment optimization required in key SiP production steps from planar test to packaging.

This enabling system integrates PI's high-throughput piezo nanopositioning technologies and ultraprecision motion control with novel algorithms. Introduced at the SPIE Photonics West 2015 conference, the groundbreaking technology was developed by PI's team that comprises more than a century of photonics alignment automation experience and includes foundational participants in the field. The system is part of PI's broad offering of photonics alignment engines ranging from software-driven stage solutions to integrated 6-axis hexapod micro-robots with built-in alignment functionality.

Watch the FMPA System Animation here, or follow the link for specifications, Datasheet and more information about the Fast Multichannel Photonics Alignment Engine.